Intel turns to 3D stacking to reboot its chip roadmap

During an event it called “Architecture Day” this week, Intel prepared us for what’s coming up in 2019. The company had a lot of announcements to make, and one of the most exciting is a new 3D packaging method for CPUs that it’s calling Foveros. Beyond Foveros, we also heard some impressive claims about next generation integrated graphics and, of …